TI嵌入式处理技术指南2(2009第三季度).pdf

OMAP™应用处理器 41
硅芯片与工具
OMAP35x 应用处理器
Part Frequency L1P L1D L2 RAM ROM External Voltage (V) 1-KU
Number CPU Graphics (MHz) (Bytes) (Bytes) (Bytes) (Bytes) (Bytes) Memory I/F DMA Timers Serial Ports Misc Core I/O Packaging Price1
OMAP3530 ARM POWERVR 600 16 K 16 K 256 K 64 K 112 K LPDDR, 32 Ch 12 GP, 5 McBSP, 4 McSPI, HW video 1 .35 1 .82 0 .4-mm PoP, 515-pin 41 .70
Cortex™-A8, SGX™ NOR, NAND, 2 WDT 3 I2C, 1 HS USB 2 .0 accelerator, PBGA (12×12 mm),
C64x+™ 430 32 K 32 K + 64 K + 64 K oneNAND, 64 Ch OTG, 1 HS USB  NEON coprocessor, 0 .5-mm PoP, 515-pin
48 K 32 K SRAM Host (3 port), LCD, TV out, PBGA (14×14 mm),
SRAM SRAM 1 HDQ/1-Wire, Camera I/F, MMU, 0 .65-mm, 423-pin
3 UART 3 MMC/SD/SDIO, PBGA (16×16 mm)
(1 IrDA+CSI) 196 GPIO (shared)
OMAP3525 ARM – 600 32 K 16 K 256 K 64 K 112 K LPDDR, 32 Ch 12 GP, 5 McBSP, 4 McSPI, HW video 1 .35 1 .82 0 .4-mm PoP, 515-pin 37 .50
Cortex-A8, NOR, NAND, 2 WDT 3 I2C, 1 HS USB 2 .0 accelerator, PBGA (12×12 mm),
C64x+ 430 32 K 32 K + 64 K + 64 K oneNAND, 64 Ch OTG, 1 HS USB  NEON coprocessor, 0 .5-mm PoP, 515-pin
48 K 32 K SRAM Host (3 port), LCD, TV out, PBGA (14×14 mm),
SRAM SRAM 1 HDQ/1-Wire, Camera I/F, MMU, 0 .65-mm, 423-pin
3 UART 3 MMC/SD/SDIO, PBGA (16×16 mm)
(1 IrDA+CSI) 196 GPIO (shared)
OMAP3515 ARM POWERVR 600 16 K 16 K 256 K 64 K 112 K LPDDR, 32 Ch 12 GP, 5 McBSP, 4 McSPI, NEON coprocessor, 1 .35 1 .82 0 .4-mm PoP, 515-pin 33 .85
Cortex-A8 SGX NOR, NAND, 2 WDT 3 I2C, 1 HS USB 2 .0 LCD, TV out, PBGA (12×12 mm),
oneNAND, OTG, 1 HS USB Camera I/F, MMU, 0 .5-mm PoP, 515-pin
SRAM Host (3 port), 3 MMC/SD/SDIO, PBGA (14×14 mm),
1 HDQ/1-Wire, 196 GPIO (shared) 0 .65-mm, 423-pin
3 UART PBGA (16×16 mm)
(1 IrDA+CSI)
OMAP3503 ARM – 600 16 K 16 K 256 K 64 K 112 K LPDDR, 32 Ch 12 GP, 5 McBSP, 4 McSPI, NEON coprocessor, 1 .35 1 .82 0 .4-mm PoP, 515-pin 22 .55
Cortex-A8 NOR, NAND, 2 WDT 3 I2C, 1 HS USB 2 .0 LCD, TV out, PBGA (12×12 mm),
oneNAND, OTG, 1 HS USB Camera I/F, MMU, 0 .5-mm