PCB製造流程簡介PCBProductionFlowIntroduction1Date1内层课介绍I/LSectionIntroduction流程介绍:flowchart目的:purpose利用影像转移原理制作内层线路Thepurposeofdevelopimagetransfertoinnerlayerline前處理preliminarytreatment涂佈coating曝光exposure显影developing裁板BOARDCUT黑棕化blackoxide蚀刻etching去膜stripping內層檢驗I/LinspectingDate2裁板(BOARDCUT):目的:purpose依制前设计所规划要求,ordingtothefront-enddesign,(PRETREAT):目的:purpose去除銅面上的污染物,增加銅面粗糙度,,increasecopperroughness,(COATING):目的:(EXPOSURE):目的:purpose经光源作用将原始底片上的图像转移到感光底板上thepurposeofexposureistooriginalitynegativeimagetransfertosensitizatenegative主要原物料:底片mainmaterial:negativeUV光曝光前曝光后内层课介绍I/LSectionIntroductionDate6显影(DEVELOPING):目的::Na2CO3mainmaterial:Na2CO3显影后Afterdeveloping显影前Beforedeveloping内层课介绍Date7蚀刻(ETCHING):目的:purpose利用药液将显影后露出的铜蚀掉,形成内层线路图形Thepurposeofetchingistoremovedevelopingthecopperontheboardsurfaceforinnerlayerline主要原物料:蚀刻药液(CuCl2)mainmaterial:(CuCl2)蚀刻后蚀刻前内层课介绍I/LSectionIntroductionDate8去膜(STRIP):目的:purpose利用强碱将保护铜面之抗蚀层剥掉,:NaOHmainmaterial:Dpunchhole目的::冲头mainmaterial:punching内层课介绍I/LSectionIntroductionDate10
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