:参照本规范设计制作Designteam::负责规范的编写、修改Productsection::参照本规范审核QAE:--7基本流程定义Mainprocess3-5流程注意事项定义Notestopayattention5--11流程单备注内容NotesinMI7-8图纸资料制作Drawinginformationmaking8-±(Min±);ThethicknesstoleranceofFPCis±(Min±).+PI补强厚度公差±(Min±);ThethicknesstoleranceofFPCandPIstiffeneris±(Min±).+FR4补强厚度公差±;ThethicknesstoleranceofFPCandFR4is±+钢片补强厚度公差±;ThethicknesstoleranceofFPCandsteelsheetis±+背胶厚度公差±;ThethicknesstoleranceofFPCandtapeis±,;ountwhencalculate,,Coverlay须扣除溢胶厚度,溢胶量依其胶厚的40%计算;Deducttheresinthickness(40%oftheadhesivethickness);Thetapethicknessdoesn’&1/2oZ铜基材,&1mil;Single-side1/3oZ&1/&1mil;&1/2oZ铜基材,CoverlayAD厚度可选择1mil;Double-side1/3oZ&1/2oZcoppermatchCoverlayAD1mil;,双面板1oZ铜基材,CoverlayAD厚度可选择1mil&;Singleanddouble-side1oZcoppermatchesCoverlayAD1mil&;;FR4:;PET:;纯PI+带胶PI+纯胶,不可使用两种带胶PI直接叠成;PIstiffener:purePI+PIwithadhesive+pureadhesive,
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