新产品开发流程Goal:detaildesignincludingeveryitemsinspecificationConceptFeasibilityDesignA-testB-testC-testMPEOLGoal:functionsimplementcriticalfunctionverificationGoal:reliabilitytestsolvedcriticalbugsGoal:productionreadinesssolvedgatingissuesGoal:uaranteeyearsclearuniquepartsinstockGoal:deliverproductsintimewithbestqualityprojectkick-offprojecttransferGoal:defineproducttomeet-marketingtrendcustomerrequirementtechnologytrend1开发流程-设计阶段ConceptFeasibilityA-testB-testC-testMPEOLGoal:defineproducttomeet-MarketingtrendCustomerrequirementTechnologytrendGoal:FunctionsimplementCriticalfunctionverificationGoal:ReliabilitytestSolvedcriticalbugsGoal:ProductionreadinessSolvedgatingissuesGoal:uaranteeyearsClearuniquepartsinstockDesignGoal:detaildesigntocheckeveryitemsinspecificationGoal:Deliverproductsintimewithbestquality2开发流程-设计阶段EECircuitDesignReviewModifyPlacementRoutingGerberoutMEIDDetailDesignMock-upReviewModifybuildnewpartssamplerequest3DdesignsamplerequestmaterialpreparingsamplerequestapplypartnumbercircuitdrawingsamplerequestapplypartnumbermodifycircuitcreateBOMreleaseBOMmodify3Ddesignreview3Ddesign3开发流程-ATestStageConceptFeasibilityDesignB-testC-testMPEOLGoal:defineproducttomeet-MarketingtrendCustomerrequirementTechnologytrendA-testGoal:functionsimplementcriticalfunctionverificationGoal:ReliabilitytestSolvedcriticalbugsGoal:ProductionreadinessSolvedgatingissuesGoal:uaranteeyearsClearuniquepartsinstockGoal:DetaildesigntocheckeveryitemsinspecificationGoal:Deliverproductsintimewithbestquality4开发流程--TestModifyMEToolingT1ReviewModifyT2GerberoutmaterialpreparingmaterialpreparingPCBAcircuitmodifymodifyBOMreleaseBOMmodify3Ddesignreview3Ddesignchecktoolingstatustrialshottrialshottroubleshooting&verification5开发流程-BTestStageConceptFeasibilityDesignA-testC-testMPEOLGoal:defineproducttomeet-MarketingtrendCustomerrequirementTechnologytrendGoal:FunctionsimplementCriticalfunctionverificationB-testGoal:reliabilitytestsolvedcriticalbugsGoal:ProductionreadinessS
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