树脂塞孔工艺流程浅析.doc

The Technology Description of Resin plugging PCB Products
PCB树脂塞孔工艺技术浅析
叶应才
深圳崇达多层线路板有限公司
：+86-7，传真：+86-8，Email:ycyesuntakpcb.
作者简介：
2002年毕业于北京理工大学，已从事8年线路板工艺技术和研发工作，主导多类PCB特别产品的研发和转量产工作，熟悉PCB产品的应用和设计原理，以及产品的可靠性评估原理手法。
文章摘要：
随着装配元器件微小型化的发展，PCB的布线面积，图案设计面积也在随之不断的减小。为了适应这一发展趋势，PCB设计和制造者们也在不断的更新设计理念和工艺的制作方法。树脂塞孔的工艺也是人们在缩小PCB设计尺寸，配合装配元器件而发明的一种技术方法。其大胆的设计构思和可规模化的生产确实在PCB的制作领域发挥了极大的推动力，有效的提高了HDI、厚铜、背板等产品的可靠性和制作工艺能力。了解和有效利用这一技术，也是许多PCB业者正在努力进行中的工作。文章概述了树脂塞孔的出现，发展和制作的技术方法，谨供大家参考。
关键词：树脂塞孔、盲孔填胶、埋孔填胶、叠层
Abstract:
Along with the development of the small dimension chip assembled, PCB’s area of trace distribution and drawing design has become smaller and smaller with the new order to keep up with this change, PCB’s designer and manufacturer are all renewing the design concept and technology of fabrication continuously.
Resin pluggedis one of technologies invented to reduce the size of PCB and fix to the chip assembly. The innovative concept and large-scale of operationof this technology really plays a integral role in the PCB’s fabricated field, it can effectively improve the reliability and capability of the PCB product such as HDI, heavy copper, backplane, and using this kind of technology isan important role in utilizing new cutting edge applications. This article explains the advantages,appearance and development of t