News Update Equipment & Materials Processing LED wafer-level bonding shipment in the probe temperature, as well , the equipment January 2006, its as frequency, when operating can be used for the simultane- features include in RMS mode. For added func- ous temporary bonding of digital signal tionality and value, the Model wafers to a carrier for subse- processing (DSP) 455 includes a standard Lake quent wafer thinning. technology, DC Shore hall probe. For details, contact: to 20 kHz AC fre- Fiona Kemp quency Further details: Tel: +49 (0)89 32007 395 response, peak Lake Shore Cryotronics Inc
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