TEST REPORT 测试报告 Product Name :HDMI TYPE A 母座正向沉板DIP型 Product No. : Sample Quantity :72PCS Test Item: 可靠性测试(Reliability Test) Test Dept. : 品管部(QA Dept.) Measure Environment : Temp. : 23±3℃, . : 35%~75% Report NO. : Total Pages :本报告共 23 页(pages) Test Date : ~ Note : 1. The results of the testing report relate only to the items tested. 2. The testing report shall not be reproduced except in full, without the written approval of HELIOWAY. Approved by XXX Checked by XXX Tested by XXX Test Group process: Test Description Sequence Test Group 1 2 3 4 5 6 7 8 9 10 11 12 Examination of product
1
Contact Current Rating 2 Contact Resistance 2. 2.
2. 2. 2. 2. 2.
Insulation Resistance
Dielectric Withstanding Voltage
T.. Signals Time Domain Impedance 2 Insertion/Withdrawal Force
Durability 5 Vibration 3. Shock 3 HumidityA 6 HumidityB 6 Salt Spray 3 Thermal Shock 3 Solder ability 2 Thermal Aging 3 Resistance to Soldering Heat 2 Sample Size per Test Group 6 6 6 6 6 6 6 6 6 6 6 6 1. Test Group 1 [Thermal Shock] : Test item & Test method : Test Item Test Method 1 LLCR According to EIA 364-06B 2 Thermal Shock According to EIA-364-32C Condition 1 Test condition : LLCR : 20mV maximum. Open circuit at 10mA maximum. Shell : measure by open circuit, 5V Max. ,100 mA Thermal Shock : 10 cycles of: –55 ℃ for 30 minutes. +85 ℃ for 30 minutes. Test request : LLCR : Initial contact resistance excluding conductor resistance: 10 mW Max. Final: 30 mW Max. Shell: Change from initial value: 50mW Max. Thermal Shock : a. No evidence of damage. b. The electrical performances should meet the spec. specified. Test value : 1 2 3 4 5 6 Visual Inspection OK OK OK OK OK OK LLCR(mW)
