【5A文】 PCB基本英文培训教材（总结).doc

PCB基本英文培训教材、中英制基本单位换算1kg=(磅)1磅==12英寸1OZ(盎司)===1000密尔mil1ft(英尺)===1000u”(uinmil)1码====35微米1in(英寸)===1000mil=,1mil====1安培/平方分米========100000Pa1马力==568ml1oC=+32oF1oF=(oF-32)/=、流程Boardcut开料Carbonprinting碳油印刷Innerdryfilm内层干膜Peelablebluemask蓝胶Inneretching内层蚀刻ENIG(Electrolessnickelimmersiongold)沉镍金Innerdryfilmstripping内层干膜退膜HAL(hotairleveling)喷锡AOI(AutomaticOpticalInspection)anicsolderabilitypreservative)有机保焊Pressing压板Punching啤板Drilling钻孔Profiling外形加工Desmear除胶渣,去钻污E-Test电性测试PTH镀通孔,沉铜FQC(finalqualitycontrol)最终检查Panelplating整板电镀FQA(Finalqualityaudit)最终抽检Outerdryfilm外层干膜Packing包装Etching蚀刻IPQA(In-processqualityaudit)流程QATinstripping退锡IPQC(In-processqualitycontrol)流程QCEQC(QCafteretching)蚀检QCIQC(ingqualitycontrol)来料检查Soldermask感阻MRB(materialreviewboard)ponentmark字符QA(Qualityassurance)品质保证PhysicalLaboratory物理实验室QC(Qualitycontrol)品质控制ChemistryLaboratory化学实验室Documentcontrolcenter文件控制中心2ndDrilling二钻Routing锣板,铣板BrownoGidation棕化Wastewatertreatment污水处理V-cutV坑WIP(workinprocess)半成品Store/(Finishedgoods)成品PPage1of32、概述PrintedCircuitBoard印制电路板FleGiblePrintedCircuit,FPC 软板Double-SidePrintedBoard双面板IPC(ircuits)电子电路互连与封装协会CPAR(Corrective&PreventiveActionRequest)要求纠正预防措施FlammabilityRate燃性等级Characteristicimpedance特性阻抗BUM(Build-upmultilayer)L(Copper-cladlaminate)ontamination eptanceQualityLevel(AQL)允收水平HDI(Highdensityinterconnecting)高密度互连板BaseMaterial基材Radius半径Capacity生产能力Diameter直径Capability工艺能力PPM(PartsPerMillion)puter-aidedmanufacturing)-aideddesign)计算机辅助设计StatisticalProcessControl统计过程控制Specification规格,规范Via导通孔Dimension尺寸Buried/blindvia埋/盲孔Tolerance公差Toolinghole定位孔Oven焗炉Output/throughput产量3、湿流程PTH(platedthroughhole)镀通孔(俗称沉铜)Acidcleaning酸性除油PP(PanelPlating)板电Aciddip酸洗Patternplat