1)焊料和焊接基礎知識Fundamentalsofsoldersandsoldering2)SMT組裝工藝SMTassemblyprocesses3)urredpriortoreflow4)urredduringreflow5)urredatpost-reflow6)匯流曲線优化Reflowprofileoptimization7)國際無鉛焊接執行狀況Statusofgloballead-freesolderingimplementation8)最具代表性無鉛合金及其特性Prevailinglead-freealloysandtheirproperties9)無鉛表層處理及其相關特性Lead-freesurfacefinishesandtheirrelativeperformance10)ponents&substratesforlead-freesoldering11)無鉛回流焊接組裝Assemblywithlead-freereflowsolderinga)印刷Printingb)回流曲線Profilesc)特殊回流曲線Specialprofilesd)微孔設計對空洞的影響Effectofmicroviadesignonvoidinge)回流气体ReflowAtmospheref)檢測Inspectiong)返修Rework12)無鉛波峰焊接組裝Assemblywithlead-freewavesolderinga)positionb)patibilityc)污染的影響Effectofcontaminationd)無鉛焊料缺陷Lead-freesolderdefects13)無鉛焊點可靠性Reliabilityoflead-freesolderjointsa)合金的影響Effectofalloyb)表層處理的影響Effectofsurfacefinishc)微結构Microstructure14)可靠性缺陷原理Reliabilityfailuremechanismsa)Grainboundaryslidingandcavitationb)銅的影響EffectofCuc)Grainand金屬化合物尺寸IMCsized)Effectofcoolingrateoncreepe)Diffusioncavitationofmixedalloysf)混合合金空洞Voidingofmixedalloysg)IMCplate15)無鉛焊接面臨的挑戰Challengesoflead-freesolderinga)黑色焊盤Blackpadsb))焊盤脫离Filletliftd)燈芯狀焊料Solderwickinge)潤濕不良Poorwettingf)Tracefractureg)錫須Tinwhiskerh)表面粗糙Roughappearancei)熱損傷Thermaldamagej)助焊劑殘留清洗Fluxresiduecleaningk)Conductiveanodicfilamentl)uracy(精度):测量结果与目标值之间的差额。AdditiveProcess(加成工艺):一种制造PCB导电布线的方法,通过选择性的在板层上沉淀导电材料(铜、锡等)。Adhesion(附着力):类似于分子之间的吸引力。Aerosol(气溶剂):小到足以空气传播的液态或气体粒子。A
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