半挠性板技术.doc

Flex-Rigid Circuit Board Techniques
Markus Wille, Product Manager, RUWEL AG, Wetter
Biography
The author was born in 1962 in Hamm. He received the graduation Diplom-Ingenieur munications in 1987 at the University of applied sciences in Dortmund. The study was focused on radiofrequency and microwave engineering. Since 1987 he has been working as a product manager in the product development department of the Wetter plant of RUWEL AG. In this function he is working on new developments and concepts of printed circuit board techniques, . for flex-rigid circuit boards, complex multilayer and microwave circuit boards. He is also involved in cooperative development projects of customers and material manufacturers.
Address
Markus Wille
RUWEL AG, Wetter Plant
Marburger Strasse 65
D-35083 Wetter / Germany
E-mail: markus.******@ruwel-
Flex-Rigid Circuit Board Techniques
Markus Wille, Product Manager, RUWEL AG, Wetter
Abstract
This paper will give an introduction to the technique of flex-rigid circuit board constructions. Reasons for using flex-rigid circuit technology will be discussed. Various build-up construction techniques will be presented: flex-rigid board construction using polyimide foil, Semiflex-technique for bend to install applications where the polyimide foil is replaced by other bendable substrate materials. Finally the new yellowflex-technique will be