微电子焊接助焊剂及其焊点组织研究.pdf

西安理工大学
硕士学位论文
微电子焊接助焊剂及其焊点组织研究
姓名:李树丰
申请学位级别:硕士
专业:材料科学与工程
指导教师:赵高扬
20050301
摘要
题目:微电子焊接助焊剂及其焊点组织研究
学科:材料科学与工程作者:李树丰
导师:赵高扬教授答辩日期:
摘要
本文以有机酸为活性剂,以铺展率作为衡量指标,进行了活性剂筛选
和配比优化,配制出性能优良的助焊剂,并对其助焊性能进行了测试。
以 Sn37Pb/Cu 焊点为参比,研究了 焊点界面上显微组
织及金属间化合物层在等温时效条件下的变化规律;研究了电镀 Ni 层和
化学镀 Ni(P)合金层对 焊点界面层扩散的抑制作用。结
果表明:
(1) 活性剂的含量存在一个最佳值:3%~5%,复合活性剂与单
组分活性剂相比,能够有效提高助焊剂的扩展率。所研制的助焊剂扩展
率高于目前传统松香型焊剂膏,焊后无残留物,无腐蚀。
(2) 经过等温时效处理后,
×10-1µm/h1/2,Sn37Pb/Cu焊点中IMC层的生长速度常数为
×10-1µm/h1/2,
度快,金属间化合物的生长属于扩散控制。
(3) .7Cu/Ni(P)/Cu焊点界面层中的
的金属间化合物为(Cu,Ni)6Sn5。焊点
程中Cu和Sn之间通过Ni层有互扩散和反应,(P)/Cu
焊点界面没有发现扩散。化学镀Ni(P)合金作为扩散阻挡层能够有效的抑
。

关键词:助焊剂;有机酸活性剂;无铅焊料;金属间化合物;界面层;
-i-
西安理工大学硕士学位论文
Study of Flux for Microelectronics Soldering and Microstructure
of Solder Joint
Author: Li Shufeng
Supervisor: Prof. Zhao Gaoyang
Abstract
In this paper, The essential ingredient of flux for microelectronics anic
acid activator’s fluxing capacity was studied by measuring the spreading property of
Sn37Pb eutectic alloy on copper substrate. The microstructure and intermetallic
compounds on the interfacial layer of solder jonts were investigated
at different aging effects of electroplated Ni layer and electroless plated Ni(P)
layer on the diffusion behavior in solder joint were also studied.
(1)The content of activator in flux has an optimum value. Comparing with single
activators, fluxes contening multiplex activators indicate excellent fluxing capacity. On
base of which a flux with good properties was synthesized and a series of experiments
according to different standards were performed to evaluate the reliability of the flux and
test results showed the flux has characteristic of low residue, no corrosion and n