Study on the adhesion of pure adhesive and PI in flexible area of RFPC Wang Menhui Huang Zhangnong Abstract Some rigid-flex PCB need to make the flexible area into non delamination structure to prevent the change of the shape of the flexible area from affecting the impedance. According to the lamination, the non-layered structure can be designed to be bonded by pure adhesive in the flexible plate and bonded by semi-cured sheet in the rigid zone. However, there are risks of poor peeling strength and easy delamination when pure adhesive is used to glue the flexible plate directly. Therefore, an effecti
