世界半导体生产机台安全设计验收标准(doc 111)英文.doc

Global Semiconductor Safety Services, LLC
SEMI S2-93A Product Safety Assessment
Final Report
世界半导体生产机台安全设计验收标准
Applied Materials
Chemical Mechanical Polishing System
Model: Mirra Trak
CMP工艺应用材料
June 19, 1998
Prepared for:
Applied Materials
3111 Coronado Drive
Santa Clara, CA 95054
Prepared by:
Global Semiconductor Safety Services, LLC
1313 Geneva Drive
Sunnyvale, CA 94089
GS3 Job No. 980029
GS3 Document No. 980029F2
Client - Confidential
保密合约
The information used to prepare this report was based on interviews with Applied Materials’ engineers. The information was also based on inspections of the Chemical Mechanical Polishing System, Model: Mirra Trak. This information was gathered over the period between February 2, 1998 and February 4, 1998, and during a re-inspection of the system on June 3, 1998. A preliminary assessment of the system was also performed on September 25, 1996 through September 26, 1996 and the results of this evaluation were also used. All observations and mendations are based on conditions and descriptions of the Chemical Mechanical Polishing System, Model: Mirra Trak, during the time of data collection and upon information made available to Global Semiconductor Safety Services. This report's significance is subject to the adequacy and representative characteristics of the Chemical Mechanical Polishing System, Model: Mirra Trak, and to prehensiveness of the tests, examinations and/or surveys made.
Reference to Global Semiconductor Safety Services, including reproduction of Global Semiconductor Safety Services’ service mark, in promotional materials, is permitted only with Global Semiconductor Safety Services’ express written consent.
The service performed has been conducted in accordance with the standards currently accepted in our profession, and at the high level of skill and care exercised by Global Semiconductor Safety Services’ staff.
Lastly, this report has been prepared as a Client-Confidential document, intended