可靠性、失效率和MTBF概念.pdf.pdf

Reliability, Failure Rate & MTBF 可靠性、失效率和MTBF概念 Page 2 Construction of IGBT module with base plate IGBT模块的基本构造(含基板) Page 3 Wear-out failures IGBT模块的基本构造决定了它的老化失效机理 Other failures (climatic stresses, chemical stresses) 其它因素(如气候变化、化学腐蚀)所造成的老化失效 End of Life: bond wire connections 绑定线连接老化所造成的使用寿命终结 End of Life: solder connections 焊接层连接老化所造成的使用寿命终结 Destruction of housing / terminals 封装/端子的老化所造成的使用寿命终结 Page 4 Bond Wire Connection Wear-out Failure 绑定线连接老化失效的典型式样 Bond-wire lift-off (left) and reconstruction of Al metallization (right) 绑定线脱离(左)和铝金属化层重组(右) Bond-wire heel cracks 绑定线跟部位置的断裂?? Page 5 Solder Connection Wear-out 焊接层(DCB-基板)的老化 Coefficient of thermal expansion (CTE) 几种材料的热膨胀系数 Fatigue of Solder Connection between DCB and Baseplate 陶瓷衬底和基板之间焊接层的老化衰变?????? Page 6 Destructionof Housing/Terminals 封装/端子的老化损坏 Frame/Terminal Cracks (due to Thermal Shock or Vibration) 封装框架/端子的断裂(热冲击或振动) Page 7 For internal use only Reliability Tests (Standard Industrial Module) 可靠性测试项目(标准工业级模块) Page 8 For internal use only Failure Criteria in Reliability Test 可靠性测试的失效检验标准 Page 9 For internal use only Power Cycling (PC) Test 可靠性测试之一:功率循环测试 Power Cycling (PC) Stressing the chip/bond wire system at two different junction temperatures. Test Points of Temperature Swing (for example):?Tj= 50K: T J1= 75?C, T J2= 125?C Failure Criteria: An Increased Saturation Voltage of 5% Power Cycling: Medium & High Power Modules (Tjmax = 125°C) 1,0E+04 1,0E+05 1,0E+06 1,0E+07 1,0E+08 1,0E+09 1,0E+10 1,0E+11 10 100 Delta Tj in K n (No. of Cycles) Traction Modules Standard Modules dotted lines: estimated Page 10 For internal use only Thermal Cycling (TC) Test 可靠性测试之一:热循环测试 ThermalCycling (TC) Heating up & Cooling down the case (base plate) at two different case temperatures. Test Points of Temperature Swing (for example): ?Tj= 80K: T C1= 20?C, T C2= 100?C Failure Criteria: An Increased Thermal Resistance of 20%