硬件需求规格说明书模板.docx

0 目录
0 目录 2
1 系统组成 3
2 系统研制要求 3
主要技术指标 3
3 硬件需求分析 3
硬件组成 3
主控 4
电源 5
唤醒输出 5
超声检测 5
磁场检测 5
温度检PB7
PA0/WKUP/USART2_CTS/ADC 12_IN0/TIM2_CH 1_ETR PA 1/USA RT2_RTS/ADC 12」N 1 /TIM2_CH；
PA2/US ART2_TX/ADC 12_IN2/T1M2_CH3 PA3/USART2_RX/ADC 12_IN3/TIM2_CH4
PA4/SP11_NSS/USART2_CK/ADC12_IN4
PA5/SPI l_SCK/ADC12_iN5
PA6/SPI l_MISO/ADCI2_IN6/TIM3_CHI
PA7/SPI1 MOSL/ADC12 IN7/T1M3 CH2
TIM4_CH3/PB8 TIM4_CH4/PB9 USART3_TX/12C2_§CL/PB 10 USART3_RX/I2C2_SDA/PBI I T1M1_BKIN/USART3_CK/12C2_SMBAL/SPI2_NSS/PBI2 T1M1_CH1 N/USART3_CTS/SPI2_SCK/PB 13 TIM 1_CH2N/USART3_RTS/SPI2_MISO/PB 14 T1M1 CH3N/SPI2 MOSI/PB15
电源
5V
J4
5V
3V3
3
3
2
2
£
x
4
3V3
3V3
3V3
3V3
3V3
5V
5V
5V
:C3 |

肌2
12V 转 5乂转
CJ7805
=t=C2

AMS1117-
=i=C4
=^C5
z±=C8
=^=C9
10uF/

10uF/



10uF/
AGND
|||'AGND
600RU)bM2A
g OUT
a
VDDA
~j" C12
下 1UF/50V
luH/300m订：
"JCB
=^=C10 =^=C11

J3 丁
V平寸
<1 12V

=f=Cl _

<S|
——r?

唤醒输出
超声检测
16
\ 1 ,r-
RIO
1
+
2K
2
hl,
»
N
磁场检测
J17
SPII SCK
3V3|
SPII NSS
SPII MISO ■ll^=
2
T
T
7
U6
SCL/SPI SCK
SDA/SP1 SDI
VDD
DRDY
NC
NC
SPI CS
VDDIO
SPI SDO
SETC
12C/〜SPI
GND
NC
€1
SETP
SoC
SPII MOSI DRDY
HMC5983
10 C42
^
9
lr
温度检测
温度传感器
AGND2
Temperature


LMT86DCKT
GND
GND
Voul
VDD
VDD
超声定位
.MMBT5551
RisrsK
»• ■ >■.
KJ -
KI175K.
MMH'ISSSI
MMBT5551
MMBT5551
15Opki50V
lKipHOV
150pF/50V|
IMIpl
l*Opl-'5OV
ISOpl-i'SOV
GND
GND
GND
MMBT5551
RJOTSK
RJ4T3K
ms 75 k
1 Vipl *fl\|
1呦卜$O\|
l!Opk'5OV
liapRSOV
isophsov
1心卜!OV
G