4层PCB制板说明.doc

PCB Specification
4层通孔板
General PCB Information
Total layer: 6
FR4 board , Er=(All layers)
LayerPCB Specification
4层通孔板
General PCB Information
Total layer: 6
FR4 board , Er=(All layers)
Layer Defination
Layer 1: Signal Layer component
Layer 2: Signal Layer
Layer 3: Signal Layer
Layer 6: Signal Layer component
PCB Fabrication Requirement:
Blue solder mask with white silk screen, no silk screen on PAD .
All via-in-the-pad are filled
100% net-list Electrical Test
50ohm line resistance control requirement
target line resistance: 50ohm±10%
width Surface stripline in layer 1th, reference layer are layer 2th.
width Surface stripline in layer 6th, reference layer are layer 5th.
width stripline in layer 4th, reference layer are layer 3th .and layer 5th


化金規格: NI: min100u”, Au: min2u”。
成型公差:+/-5mil
孔銅規格:,埋孔:,盲孔:
孔徑公差:PTH:+/-3mil,NP:+/-2mil
%
BGA封装必须用OSP工艺，其她化金解决。
G. V-cut規格: 30+/-5度,+/-.
H. 每PCS電測, 每PCS加蓋EE章(電測合格章).
I. KEYP