IPC标准.doc

IPC标准.docIPC标准|第1
IPC-TR-470
Thermal Characteristics of Multilayer Interconnection Boards (多层互连板的热特性)
1/74 (orig. pub.)
IPC-TR-474
An Overvies on Electronic Hard Round Robin IV Phase I
9/75 (orig. pub.)
IPC-TR-481
Results of Multilayer Test Program Round Robin V (多层V循环测试程序的结果)
4/81 (orig. pub.)
IPC-TR-483
Dimensional Stability Testing of Thin Laminates - Report on Phase I International Round Robin Test Program (薄层压板尺寸稳定性测试)
4/84 (orig. pub.) 10/87 Addendums Revised 3/91
IPC-TR-484
Results of IPC Cooper Foil Ductility Round Robin Study (IPC Cooper 箔延展性研究联合报告)
4/86 (orig. pub.)
IPC-TR-485
Results of Cooper Foil Rupture Strength Test Round Robin Study (Cooper 箔断裂强度研究联合报告)
3/85 (orig. pub.)
IPC-TR-549
Measles in Printed ounting and Interconnecting Electronic ponents (电子元件安装互连印制板的质量评定)
7/93 (orig. pub.)
IPC-DR-570
General Specification for 1/8 Inch Diameter Shank Carbide Drills for Printed Boards (1/8英寸印制板硬质合金钻头总技术规范)
1/79 (orig. pub.) A 4/84
IPC-DR-572
Drilling Guidelines for Printed Boards (印制板钻孔指南)
4/88 (orig. pub.)
IPC-TR-576(已作废)
Additive Process Evaluation
9/77 (orig. pub.)
IPC-TR-578
Leading Edge Manufacturing Technology Report - Resulting of a Round Robin Study on Minimum Conductor aterial (检查/测试印制板,元件和材料的设备鉴定)
8/88 (orig. pub.) A 11/97
IPC-MI-660
Ining Inspection of Rablies
9/67 (orig. pub.) A 12/71 B 9/77 C 1/88
IPC-TA-720
Technology Assessment Handbook on Laminates (层压板技术评估手册)
IPC-TA-721
Technology Assessment Handbook on Multilayer Boards (多层板技术评估手册)
IPC-TA-722
Technology Assessment of Soldering (焊接技术评估)
IPC-TA-723
Technology Assessment Handbook on Surface Mounting (表面组装技术评估手册)
IPC-TA-724
Technology Assessment Series on Cleanrooms (净化间技术评估)
4/98
IPC-PE-740
Troubleshooting Guide for Printed Board Manufacture and Assembly (印制板制造及组装故障修理指南)
1/85 (orig pub.)
A 12/97
IPC-CM-770
Printed Board ponent Mounting (印制板元件安装)
9/68 (orig. pub.) A 3/76 B 10/80 C 1/87 D 1/96
IPC-