PCB命名规则详解..doc

SMD:SurfaceMountDevices/表面贴装元件SOT:ransistor/小外形晶体管SOD:Smalloutlinediode/小外形二极管SOIC:SmalloutlineIntegratedCircuits/小外形集成电路SSOIC:ShrinkSmallOutlineIntegratedCircuits/缩小外形集成电路SOP:SmallOutlinePackageIntegratedCircuits/小外形封装集成电路SSOP:ShrinkSmallOutlinePackageIntegratedCircuits/缩小外形封装集成电路TSOP:ThinSmallOutlinePackage/薄小外形封装TSSOP:ThinShrinkSmallOutlinePackage/薄缩小外形封装SOJ:SmalloutlineIntegratedCircuitswithJLeads/“J”形引脚小外形集成电路PQFP:PlasticQuadFlatPack/塑料方形扁平封装SQFP:ShrinkQuadFlatPack/缩小方形扁平封装CQFP:CeramicQuadFlatPack/陶瓷方形扁平封装QFN:QuadFlat-packNo-leadPackage/:Plasticleadedchipcarriers/:hipcarriers/无引线陶瓷芯片载体DIP:Dual-In-ponents/双列引脚元件PBGA:PlasticBallGridArray/塑封球栅阵列器件RF:射频微波类器件DIODE:二极管LED:发光二极管TO:TransistorsOutlines,patibletypes/晶体管外形,JEDEC元件类型PGA:PlasticGridArray/塑封阵列器件RELAY:Relay/继电器SIP:Single-In-ponents/单排引脚元件TRAN:Transformer/变压器的命名方法SW:Switch/开关类器件IND:Inductance/电感类DIN:欧式连接器表1各种焊盘的命名方法焊盘类型简称标准图示命名SMD|PAD表面贴装方焊盘SMDS命名方法:SMDS+边长命名举例:SMDS30表面贴装长方焊盘SMDR命名方法:SMDR+宽(Y)X长(X)(mil)命名举例:SMDR21X27,SMDR10X40表面贴装圆焊盘SMDC命名方法:SMDC+焊盘直径C(mil)命名举例:SMDC20,SMDC18,SMDC14表面贴装椭圆焊盘SMDO命名方法:SMDO+宽(Y)X长(X)命名举例:SMDO28X165,SMDO37X280,SMDO50X280PTH|PAD金属化通孔圆焊盘PADC命名方法:PADC+焊盘外径C(mil)+D+孔径(mil)+(P)P表示压接孔,公差为+/-:PADC45D30,PADC60D37金属化通孔方焊盘PADS命名方法:PADS+焊盘边长(P)(mil)+D+孔径(mil)命名举例:PADS45D30,PADS80D60金属化通孔长方焊盘PADR命名方法:PADR+X宽(Y)X长(X)(mil)+D+孔径(mil)命名举例:PADR30X45D24,PADR60X80D40金属化通孔椭圆焊盘PADO命名方法:PADO+宽(Y)(mil)X长(X)(mil)-焊环宽度(mil)命名举例:PADO70X100-10金属化矩形焊盘椭圆通孔PADOS命名方法:PADOS+盘宽(Y)(mil)X长(X)(mil)-椭圆的宽(Y)(mil)X长(X)(mil)命名举例:PADOS100X120-70X100NPTH|PAD非金属化通孔圆焊盘PADNC命名方法:PADNC+孔径(mil)命名举例:PADNC122,PADNC62非金属化方孔PADNS命名方法:PADNS+边长(mil)命名举例:PADNS60非金属化长方孔PADNR命名方法:PADNR+宽(mil)X长(mil命名举例:PADNR100X200非金属化通孔椭圆焊盘PADNo命名方法:PADNo+宽(mil)X长(mil)命名举例:PADNo71X96热焊盘TH圆热焊盘命名方法:TH+孔环外径命名举例:TH68椭圆热焊盘命名方法:TH+宽(mil)X长(mil)命名举例:TH68X96不规则焊盘PADSPD命名方法:PADSPD+宽(mil)X长(mil)X高(mil)过孔VIA命名方法:VIA+孔径(mil)X焊盘外径(mil)命名举例:VIA10X20盲埋孔BVIA命名方法:BVIA+孔径(mil)X焊盘外径(mil)_*-*命名举例:BVIA10X20_1-2、BVIA10X20_2-3电阻类(见表6)表6:分类中文名称命名细则实例备注R贴片电阻R_尺寸规格R_04