PCB命名规则详解.docx

PCB命名规则详解.docxSMD:SurfaceMountDevices/表面贴装元件SOT:SOD:SOIC:SSOIC:ransistor/小外形晶体管Smalloutlinediode/小外形二极管SmalloutlineIntegratedCircuits/小外形集成电路ShrinkSmallOutlineIntegratedCircuits/缩小外形集成电路SOP:SmallOutlinePackageIntegratedCircuits/小外形封装集成电路SSOP:ShrinkSmallOutlinePackageIntegratedCircuits/缩小外形封装集成电路TSOP:ThinSmallOutlinePackage/薄小外形封装TSSOP:SOJ:ThinShrinkSmallOutlinePackage/薄缩小外形封装SmalloutlineIntegratedCircuitswithJLeads/"J”形引脚小外形集成电路PQFP:SQFP:CQFP:QFN:PlasticQuadFlatPack/塑料方形扁平封装ShrinkQuadFlatPack/缩小方形扁平封装CeramicQuadFlatPack/陶瓷方形扁平封装QuadFlat-packNo-leadPackage/:LCC:Plasticleadedchipcarriers/hipcarriers/无引线陶瓷心片载体DIP:Dual-In-ponents/双列引脚兀件PBGA:RF:DIODE:PlasticBallGridArray/塑封球栅阵列器件射频微波类器件二极管LED: 发光二极管TO:TransistorsOutlines,patibletypes/晶体管外形,JEDEC元件类型PGA:PlasticGridArray/塑封阵列器件RELAY:Relay/继电器SIP:Single-In-ponents/单排引脚元件TRAN:Transformer/变压器的命名方法SW: Switch/开关类器件IND: Inductance/电感类DIN: 欧式连接器表1各种焊盘的命名方法焊盘类型简称标准图示命 名表面贴1—命名方法:SMDS+边长装方焊盘SMDS—命名举例:SMDS30SM表面贴装长方焊盘SMDRr_|1命名方法:SMDR+宽(Y)X长(X)(mil)D11J命名举例:SMDR21X27,SMDR10X401PAD表面贴装圆焊盘SMDC命名方法:SMDC+焊盘直径C(mil)1vJ命名举例:SMDC20,SMDC18,SMDC14表面贴命名方法:SMDO+宽(Y)X长(X)装椭圆焊盘SMDOX命名举例:SMD028X165,SMD037X280,SMD050X280金属化通孔圆PADC/ \命名方法:PADC+焊盘外径C(ndl)+D+孔径(mil)+(P)P表示压接孔,公差为+/-0・05mmpTH1焊盘tC■命名举例:PADC45D30,PADC60D37金属化D「—]命名方法PADS+焊盘边长(P)(mil)+D+孔径(mil)PA通孔方焊盘PADS命名举例:PADS45D30,PADS80D60D金属化通孔长方焊盘PADR0i命名方法:PADR+X宽(Y)X长(X)(mil)+D+孔径(ndl)I命名举例:PADR30X45D24,PADR60X80D40金属化通孔椭PADO圆焊盘NPTHIPAD金属化矩形焊盘椭圆通孔非金属化通孔圆焊盘非金属化方孔非金属化长方孔非金属化通孔椭圆焊热焊盘不规则焊盘过孔PADOSPADNCPADNSPADNRPADNoPADSPDVIA命名方法:PAD0+宽(Y)(mil)X长(X)(mil)-焊环宽度(m订)命名举例:PAD070X100-10命名方法:PAD0S+盘宽(Y)(mil)X长(X)(mil)-椭圆的宽(Y)(mil)X长(X)(mil)命名举例:PAD0S100X120-70X100命名方法:PADNC+孔径(m订)命名举例:PADNC122,PADNC62命名方法:PADNS+边长(m订)命名举例:PADNS60命名方法:PADNR+宽(m订)X长(Ml命名举例:PADNR100X200命名举例:PADNo71X96圆热焊盘命名方法:TH+孔环外径命名举例:TH68椭圆热焊盘命名方法:TH+宽(ndl)X长(in订)命名举例:TH68X96命名方法:PADNo+宽(ndl)X长(mil)命名方法:PADSPD+宽(ndl)X长(m订)X高(ndl)命名方法:VIA+孔径(mil)X焊盘外径(mil)命名举例:VIA10X20命名方法:BVIA+孔径(ndl)X焊盘外径(mil)盲埋孔BVIA _*-*命名举例:BVIA10X20_l-2、BVIA10X20_2-3电阻类(见表6)分类中文名称